Jun-Xi Liu

Title: Innovations by Jun-Xi Liu in Electronic Component Disassembly

Introduction

Jun-Xi Liu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronic component disassembly, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is an "Apparatus for disassembling electronic component from circuit board." This apparatus includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base, while the positioning assembly is arranged on the base and coupled to the controller. It is designed to position the circuit board at a predetermined location. The heating and suction assembly is movably arranged on the base and is also coupled to the controller. This assembly is responsible for heating the electronic component and then using suction to attract and hold the heated component, effectively disassembling it from the circuit board.

Career Highlights

Throughout his career, Jun-Xi Liu has worked with prominent companies such as Fu Tai Hua Industry (Shenzhen) Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronic components.

Collaborations

He has collaborated with notable coworkers, including Jin-Song Zheng and Jing-Bin Liang, further enhancing his innovative capabilities.

Conclusion

Jun-Xi Liu's work in developing apparatuses for disassembling electronic components demonstrates his commitment to innovation in technology. His patents reflect a deep understanding of the complexities involved in electronic disassembly, marking him as a significant figure in this field.