Company Filing History:
Years Active: 2014-2015
Title: Innovations by Jun Wan: Pioneering Wire Bonding Technology
Introduction
Jun Wan is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of wire bonding technology, holding a total of 2 patents. His innovative designs have enhanced the efficiency and effectiveness of wire bonding machines.
Latest Patents
Jun Wan's latest patents include a lead frame support plate and a window clamp for wire bonding machines. The lead frame support plate features a network of suction grooves on its support surface. Each suction groove is designed to be in fluid communication with at least one vacuum hole, allowing a suction force to be generated. This suction force holds the lead frame securely against the support surface. Additionally, the window clamp incorporates slots that compensate for deformation, ensuring optimal performance during operation. A method for fabricating the lead frame support plate is also included in his patents.
Career Highlights
Jun Wan is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop innovative solutions in the field of wire bonding. His work has been instrumental in advancing the technology used in this critical area of manufacturing.
Collaborations
Some of Jun Wan's notable coworkers include Phui Phoong Chuang and Hasrul Bin Hasim. Their collaborative efforts contribute to the ongoing success of their projects and innovations.
Conclusion
Jun Wan's contributions to wire bonding technology through his patents and work at Asm Technology Singapore Pte Ltd highlight his role as a key innovator in the industry. His inventions are paving the way for advancements in manufacturing processes.