Dongguan, China

Jun Tian

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Dongguan University of Technology. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Tian. Retrieved from https://idiyas.com/inventor/jun-tian-jwdeeix5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Jun Tian in Ceramic 3D Printing.

Introduction

Jun Tian is an accomplished inventor based in Dongguan, China. He has made significant contributions to the field of 3D printing, particularly in ceramic technology. His innovative approach has led to the development of a unique ceramic 3D printer that enhances product quality and printing efficiency.

Latest Patents

Jun Tian holds a patent for a descending type ceramic 3D printer. This invention features a rack with a sealed charging block, a lifting device for printing, and a scraping device that ensures the flatness of each printed layer. The design allows for gradual descent of the charging block, improving the quality of the final product by ensuring precise joint performance.

Career Highlights

Jun Tian is affiliated with Dongguan University of Technology, where he continues to advance his research in 3D printing technologies. His work has garnered attention for its innovative solutions to common challenges in the field.

Collaborations

Jun Tian collaborates with Jun Deng, a fellow researcher, to further explore advancements in ceramic 3D printing. Their partnership aims to push the boundaries of what is possible in this technology.

Conclusion

Jun Tian's contributions to ceramic 3D printing exemplify the spirit of innovation in modern technology. His patent and ongoing research are paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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