Location History:
- Kokubu, JP (1990)
- Kagoshima, JP (1995)
Company Filing History:
2 out of 6,656 
1 out of 22 Years Active: 1990-1995
Title: Innovations by Jun Tanaka in Semiconductor Packaging
Introduction
Jun Tanaka is a notable inventor based in Kagoshima, Japan. She has made significant contributions to the field of materials science, particularly in the development of innovative substrates for semiconductor packaging. With a total of two patents to her name, her work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
Jun Tanaka's latest patents include a composition for producing low temperature co-fired substrates. This novel crystallizable glass composition is designed to create low temperature co-fired glass-ceramic substrates that incorporate patterns of low electrical-resistance conductors such as silver, silver-palladium, gold, and copper. The firing process allows the crystallizable glass to precipitate mullite as the main crystalline phase, along with subordinate phases like forsterite, spinel, and sapphirine. Additionally, her composition includes an inorganic filler that enhances the properties of the glass, resulting in substrates with high flexural strength, low dielectric constant, and controllable thermal expansion coefficients. Another patent involves a package for housing semiconductor elements, which features an insulating substrate with a cavity for semiconductor attachment, covered by a lid member. This substrate is composed of a mullite sintered body, ensuring durability and efficiency in semiconductor applications.
Career Highlights
Throughout her career, Jun Tanaka has worked with prominent companies such as Kyocera Corporation and Yamamura Glass Co., Ltd. Her experience in these organizations has allowed her to refine her expertise in materials engineering and semiconductor technology.
Collaborations
Jun has collaborated with esteemed colleagues, including Tomoyuki Taguchi and Hideyuki Kuribayashi. Their joint efforts have contributed to advancements in the field and have fostered innovation in semiconductor packaging solutions.
Conclusion
Jun Tanaka's contributions to the field of semiconductor packaging through her innovative patents demonstrate her expertise and commitment to advancing technology. Her work continues to influence the industry and pave the way for future developments in materials science.