The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 1990
Filed:
May. 24, 1988
Jun Tanaka, Kokubu, JP;
Hitoshi Oikawa, Kokubu, JP;
Yoshinobu Kunitomo, Kokubu, JP;
Masami Terasawa, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
Disclosed is a package for housing semiconductor elements, which comprises an insulating substrate having in the interior thereof a cavity for attaching and housing semiconductor elements and a lid member covering said cavity, wherein the insulating substrate is composed of a mullite sintered body comprising 70 to 95% by weight of mullite and 5 to 30% by weight, as the total content, of silica (SiO.sub.2) and at least one member selected from the group consisting of magnesia (MgO) and calcia (CaO), and SiO.sub.2, MgO and CaO are present in the following composition expressed by % by weight based on the three components: