Jun Simizu

Title: Innovations by Jun Simizu in IC Package Testing

Introduction

Jun Simizu is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of integrated circuit (IC) package testing. His innovative approach has led to the development of a unique testing device that enhances the accuracy and efficiency of IC package evaluations.

Latest Patents

Jun Simizu holds 1 patent for his invention titled "IC package testing device and method for testing IC package using the same." This patent describes a sophisticated system where coordinate data for the array pattern of contact pins and solder balls of an IC package is stored by a positioning section of the testing device. The device adjusts the position of a ball grid array (BGA) to ensure that the contact pins and solder balls accurately overlap. The solder balls are then pressed against the respective contact pins with an optimal load, while the load applied to the IC package is measured by load cells.

Career Highlights

Jun Simizu is currently employed at NEC Machinery Corporation, where he continues to innovate in the field of IC testing technologies. His work has been instrumental in improving the reliability and performance of electronic components.

Collaborations

Jun collaborates with Akio Horimoto, a fellow innovator, to further enhance the capabilities of their testing devices. Their teamwork has led to advancements in the efficiency of IC package testing processes.

Conclusion

Jun Simizu's contributions to IC package testing demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic testing methods.