The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
Aug. 16, 2000
Applicant:
Inventors:
Jun Simizu, Shiga, JP;
Akio Horimoto, Shiga, JP;
Assignee:
NEC Machinery Corporation, Kusatsu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/102 ;
U.S. Cl.
CPC ...
G01R 3/102 ;
Abstract
Coordinate data for the array pattern of contact pins and coordinate data for the array pattern of solder balls of an IC package is stored by a positioning section of an IC package testing device. The position of a BGA is adjusted so that the contact pins and the solder balls accurately overlap each other. The solder balls of the IC package are abutted on the respective contact pins while the IC package is sucked onto by a suction head. Then, the solder balls are abutted on the respective contact pins with an optimal load while measuring a load applied to the IC package by load cells.