Company Filing History:
Years Active: 2002
Title: Akio Horimoto: Innovator in IC Package Testing Technology
Introduction
Akio Horimoto is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of integrated circuit (IC) packaging technology. His innovative approach has led to advancements that enhance the efficiency and accuracy of IC package testing.
Latest Patents
Horimoto holds a patent for an "IC package testing device and method for testing IC package using the same." This invention involves a sophisticated system where coordinate data for the array pattern of contact pins and solder balls of an IC package is stored by a positioning section of the testing device. The technology ensures that the position of a ball grid array (BGA) is adjusted so that the contact pins and solder balls accurately overlap each other. The process involves the solder balls being abutted on the respective contact pins while the IC package is held by a suction head. Furthermore, the solder balls are pressed against the contact pins with an optimal load, which is measured by load cells.
Career Highlights
Akio Horimoto is currently employed at NEC Machinery Corporation, where he continues to develop and refine technologies related to IC packaging. His work has been instrumental in improving testing methods that are crucial for the reliability of electronic devices.
Collaborations
Horimoto collaborates with Jun Simizu, a coworker who shares his passion for innovation in the field of electronics. Together, they work on projects that aim to push the boundaries of current technology.
Conclusion
Akio Horimoto's contributions to IC package testing technology exemplify the spirit of innovation. His patent and ongoing work at NEC Machinery Corporation highlight his commitment to advancing the field. His efforts not only improve testing methods but also enhance the overall reliability of electronic devices in the market.