Chengdu, China

Jun Qiang Wu

This inventor holds 2 USPTO granted patents and 14 published patent applications. Top assignee: Siemens Aktiengesellschaft. Active years: 2019-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Qiang Wu. Retrieved from https://idiyas.com/inventor/jun-qiang-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 65(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Jun Qiang Wu

Introduction

Jun Qiang Wu is a notable inventor based in Chengdu, China, recognized for his contributions in the field of industrial technology. With an impressive portfolio of patents, he continues to push the boundaries of innovation in his industry.

Latest Patents

Jun Qiang Wu holds two patents, with his latest invention being an Industrial Gateway Module. This technology is crucial for enhancing communication and data exchange in manufacturing environments, underscoring his ability to innovate solutions that meet modern industrial challenges.

Career Highlights

Currently, Wu is employed at Siemens Aktiengesellschaft, a global leader in engineering and technology. His work there reflects his commitment to developing cutting-edge solutions that drive efficiency and effectiveness in industrial applications.

Collaborations

Throughout his career, Wu has collaborated with talented colleagues, including Zhao Hui Zhao and Bo Yuan Sun. These partnerships highlight the collaborative spirit within the engineering community, fostering innovation through shared expertise and ideas.

Conclusion

Jun Qiang Wu stands as an exemplary figure in the field of invention and innovation, with a clear focus on developing technologies that advance industrial capabilities. His contributions not only enhance operational efficiencies but also inspire future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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