Jun-Peng Shi

Title: Innovations by Jun-Peng Shi in LED Technology

Introduction

Jun-Peng Shi is a prominent inventor based in Xiamen, China. He has made significant contributions to the field of optoelectronics, particularly in the development of light-emitting diode (LED) technology. With a total of 3 patents to his name, his work has been instrumental in advancing LED packaging methods.

Latest Patents

Jun-Peng Shi's latest patents include innovative designs for LED packages. One of his notable inventions is a light-emitting diode (LED) package that features a substrate with upper and lower surfaces. This design incorporates a metal block and an electrically insulating region surrounding it. An LED chip is mounted on the substrate, establishing electrical communication with the metal block, and is covered by an encapsulant that protects the upper surface of the LED chip. Another patent focuses on a light-emitting system that includes multiple LED chips and a package support designed for these chips.

Career Highlights

Jun-Peng Shi is currently associated with Xiamen Sanan Optoelectronics Technology Co., Ltd. His work at this company has allowed him to explore and implement cutting-edge technologies in LED packaging and fabrication methods. His contributions have not only enhanced the efficiency of LED systems but have also paved the way for future innovations in the field.

Collaborations

Throughout his career, Jun-Peng Shi has collaborated with notable colleagues, including Pei-Song Cai and Hao Huang. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Jun-Peng Shi's work in LED technology exemplifies the spirit of innovation and dedication to advancing optoelectronic solutions. His patents reflect a commitment to improving the functionality and efficiency of LED systems, making a lasting impact in the industry.