Jun Omori

Title: Jun Omori: Innovator in Semiconductor Technology

Introduction

Jun Omori is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of surface mounting devices. His innovative approach has led to advancements that enhance the reliability and performance of semiconductor devices.

Latest Patents

Jun Omori holds a patent for a semiconductor device of surface mounting type and method for fabricating the same. This invention involves an integrated circuit (IC) chip and overhang portions that are adhered to tape using an elastic adhesive agent layer. A plurality of solder balls are attached to the tape, allowing for stable electrical connections to a printed board. The design effectively absorbs thermal stress caused by temperature cycles, ensuring that the solder balls maintain their connection over time.

Career Highlights

Jun Omori is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work has been instrumental in advancing semiconductor manufacturing processes, contributing to the overall efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Jun Omori has collaborated with esteemed colleagues such as Hideo Taguchi and Junichi Asada. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jun Omori's contributions to semiconductor technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a commitment to enhancing device performance and reliability, marking him as a significant figure in the field.