Hiroshima, Japan

Jun Ohya



Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2015-2018

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2 patents (USPTO):Explore Patents

Title: Innovations of Jun Ohya in Cutting Technology

Introduction

Jun Ohya is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of cutting technology, particularly through his innovative patents. With a total of 2 patents, Ohya has developed advanced methods and apparatuses that enhance the efficiency and accuracy of cutting processes.

Latest Patents

Ohya's latest patents include a wire saw apparatus and a method of cutting workpieces with a wire saw. The wire saw apparatus executes cut-machining by pressing a workpiece against cutting wire that is spirally wound around multiple wire guides. This innovative design allows for simultaneous swinging of the wire guides and cutting wire, controlled by a sophisticated controller that adjusts the position of the workpiece holder. The method of cutting workpieces efficiently utilizes tension adjusters to maintain a predetermined target tension in the wire, significantly improving the cutting process's accuracy and effectiveness.

Career Highlights

Jun Ohya is currently employed at Toyo Advanced Technologies Co., Ltd., where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of wire saw technology, making it more efficient and precise.

Collaborations

Ohya collaborates with talented individuals such as Masaru Fukuman and Shoji Imakurusu, who contribute to the innovative environment at Toyo Advanced Technologies Co., Ltd. Their teamwork fosters creativity and leads to groundbreaking advancements in cutting technology.

Conclusion

Jun Ohya's contributions to cutting technology through his patents demonstrate his commitment to innovation and excellence. His work not only enhances the efficiency of cutting processes but also sets a standard for future developments in the field.

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