The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Oct. 15, 2012
Applicant:
Toyo Advanced Technologies Co., Ltd., Hiroshima-shi, JP;
Inventors:
Shoji Imakurusu, Hiroshima, JP;
Toshimitsu Iwai, Hiroshima, JP;
Jun Ohya, Hiroshima, JP;
Masaru Fukuman, Hiroshima, JP;
Assignee:
Toyo Advanced Technologies Co., Ltd., Hiroshima, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23D 61/18 (2006.01); B23D 57/00 (2006.01); B28D 5/04 (2006.01); B24B 27/06 (2006.01);
U.S. Cl.
CPC ...
B23D 61/185 (2013.01); B23D 57/0061 (2013.01); B24B 27/0633 (2013.01); B28D 5/045 (2013.01);
Abstract
A wire saw apparatusexecutes cut-machining by pressing a workpiece W against a cutting wirespirally wound around multiple wire guides, while running the cutting wireand simultaneously swinging the wire guidesas well as the cutting wire. The wire saw apparatusincludes a controllercontrolling a position of a workpiece holderfor holding the workpiece W. The position is controlled depending on a swing angle of the cutting wireso that machined portion of the workpiece W is shaped into an arc.