Company Filing History:
Years Active: 1997-2001
Title: Jun Ohkura: Innovator in Wafer Processing Technology
Introduction
Jun Ohkura is a prominent inventor based in Kumamoto, Japan. He has made significant contributions to the field of wafer processing technology. With a total of 2 patents, his work has advanced the efficiency and effectiveness of substrate processing methods.
Latest Patents
Ohkura's latest patents include a substrate processing apparatus and a substrate processing method. The wafer processing apparatus features a common path that extends in the Y-axis direction, allowing for the conveyance of one or multiple wafers. It incorporates a plurality of process units stacked on both sides of the common path, forming multi-stage structures. A main handler moves along the common path in the Y-axis direction and can rotate about a Z-axis to facilitate the loading and unloading of wafers into and from the process units. The apparatus also includes an arm section that moves in the main handler in the Z-axis direction, equipped with multiple holding arms that can advance and retreat on an X-Y plane. An optical sensor is integrated into the arm section to detect the holding state of the wafers, while a controller manages the operations of the main handler, arm section, and holding arms based on the sensor's detection results.
Career Highlights
Jun Ohkura is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His innovative work has positioned him as a key figure in the development of advanced wafer processing technologies.
Collaborations
Ohkura collaborates with talented coworkers, including Naruaki Iida and Hiroyuki Kudou. Their combined expertise contributes to the success of their projects and the advancement of technology in their field.
Conclusion
Jun Ohkura's contributions to wafer processing technology through his patents and work at Tokyo Electron Limited highlight his role as an influential inventor. His innovations continue to shape the future of substrate processing methods.