Company Filing History:
1 out of 1,194 
1 out of 1 Years Active: 1996
Title: The Innovative Mind of Jun Miyagi: Revolutionizing Semiconductor Clamping Technology
Introduction
Jun Miyagi, an accomplished inventor hailing from Fukuoka, Japan, has made significant strides in the field of semiconductor technology. With a keen focus on innovations that enhance manufacturing processes, Miyagi is recognized for his patent that targets the critical aspect of electrostatic clamping.
Latest Patents
Miyagi holds a single patent titled "Electrostatic Chuck." This invention is designed for electrostatically clamping semiconductor wafers, ensuring minimal plane temperature differences during operation. The electrostatic chuck features a dielectric layer affixed to a metal plate, along with an inner electrode situated within the dielectric layer. Notably, the chuck's design includes a raised outer rim and multiple protrusions that allow for efficient clamping of the semiconductor wafer by enabling direct contact with its upper surfaces. The dielectric layer has a volume resistivity of 10^9 Ω·m or less, with specific height and roughness measurements ensuring optimal functionality. The clamping surface area ratio adds to its effectiveness, being at least 1% but less than 10% of the upper surface area.
Career Highlights
Miyagi's professional journey includes a valuable tenure at notable companies such as Toto Ltd. and Anelva Company. His experience at these organizations has enriched his expertise and contributed to his innovative capabilities in the tech industry.
Collaborations
Throughout his career, Jun Miyagi has collaborated with influential colleagues, including Tetsuo Kitabayashi and Atsushi Obara. These partnerships have likely fostered an environment of innovation, leveraging diverse skills and perspectives to enhance their projects in semiconductor technology.
Conclusion
Jun Miyagi stands out as a pioneering inventor in the semiconductor industry. His patent for the electrostatic chuck exemplifies a commitment to innovation and improvement in manufacturing processes. As the technological landscape evolves, his contributions will undoubtedly continue to influence future advancements in the field.