Beijing, China

Jun Ji

This inventor holds 1 USPTO granted patent. Top assignee: Beijing Baidu Netcom Science Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Ji. Retrieved from https://idiyas.com/inventor/jun-ji-2m03u0mh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jun Ji: Inventor in Artificial Intelligence

Introduction

Jun Ji is an inventor based in Beijing, China. His work includes a patented approach to multi-round dialogue processing, an area connected to artificial intelligence, intelligent voice systems, deep learning, and natural language processing. The available information lists 1 patent for him.

Latest Patents

Jun Ji’s patent, “Multi-round dialogue processing method and apparatus, electronic device and storage medium,” describes a method for generating responses during a multi-round conversation. It acquires a user’s query and identifies the query’s intent, then selects a corresponding scenario and a matching node in that scenario’s node tree. The method uses the matched node to determine a recommended script and combines it with reply and guide scripts to generate a response to the user.

Career Highlights

The patent is assigned to Beijing Baidu Netcom Science Technology Co., Ltd. Its described system brings together intent recognition, scenario selection, and scripted recommendations to support conversational interactions.

Collaborations

The provided information names Meng Wang and Weidong Zhang as Jun Ji’s coworkers. It does not specify their roles or contributions to the patent.

Conclusion

Jun Ji’s listed patent focuses on structuring dialogue context and combining response scripts to generate replies, reflecting an application of artificial intelligence to conversational systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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