Jun-ichi Mori

Title: Jun-ichi Mori: Innovator in Flexible Print Wiring Board Technology

Introduction

Jun-ichi Mori is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of flexible print wiring boards, particularly through his innovative methods and techniques. His work has been recognized in the form of patents that enhance the manufacturing processes of electronic components.

Latest Patents

Mori holds a patent for a "Method for preparing substrate for flexible print wiring board." This invention involves a method for preparing a substrate that includes a polyimide-based resin layer. The process entails applying a solution of a polyimide-based resin precursor directly onto an electrically conducting material. This precursor layer is then cured by heating, resulting in a durable polyimide-based resin layer. The method is characterized by the application of two types of polyimide-based resin precursors, which help resolve residual strain generated during the curing process.

Career Highlights

Throughout his career, Jun-ichi Mori has worked with prominent companies such as Unitika Ltd. and Nippon Kayaku Kabushiki Kaisha. His experience in these organizations has allowed him to develop and refine his expertise in materials science and engineering, particularly in the realm of flexible electronics.

Collaborations

Mori has collaborated with notable colleagues, including Akira Shigeta and Takeshi Yoshida. These partnerships have contributed to the advancement of technology in the field of flexible print wiring boards.

Conclusion

Jun-ichi Mori's innovative work in the development of flexible print wiring board technology has made a lasting impact on the electronics industry. His patented methods continue to influence manufacturing processes and improve the performance of electronic devices.