The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2005
Filed:
Jun. 11, 2001
Akira Shigeta, Kyoto, JP;
Takeshi Yoshida, Kyoto, JP;
Jun-ichi Mori, Kyoto, JP;
Yoshiaki Echigo, Kyoto, JP;
Ryoichi Hasegawa, Saitama, JP;
Minoru Noji, Gunma, JP;
Seiichi Hayashi, Saitama, JP;
Makoto Uchida, Saitama, JP;
Akira Shigeta, Kyoto, JP;
Takeshi Yoshida, Kyoto, JP;
Jun-ichi Mori, Kyoto, JP;
Yoshiaki Echigo, Kyoto, JP;
Ryoichi Hasegawa, Saitama, JP;
Minoru Noji, Gunma, JP;
Seiichi Hayashi, Saitama, JP;
Makoto Uchida, Saitama, JP;
Unitika Ltd., Hyogo, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an electrically conducting material to form a polyimide based resin precursor layer and then the precursor layer is cured by heating to prepare a polyimide based resin layer, characterized in that a solution of a polyimide based resin precursor B, which is one of solutions of two types of polyimide based resin precursors, is directly applied on an electrically conducting material and then, on the resultant layer is applied a solution of a polyimide based resin precursor A which allows resolving the residual strain generated in the polyimide based resin formed by the curing of the above polyimide based resin precursor B.