This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Jun Ho Kang and His Work in Printed Circuit Board Materials.
Introduction
Jun Ho Kang is an inventor associated with Suwon, South Korea, and Samsung Electro-Mechanics Co., Ltd. His disclosed work concerns copper-clad laminates and printed circuit board manufacturing. The available information lists 1 patent associated with him.
Latest Patents
Kang is named on the patent “Copper Clad Laminate, Printed Circuit Board, and Method of Manufacturing the Same.” The disclosure describes an insulating layer positioned between two copper foil layers. One foil layer contacts the insulating layer with its rough surface, while the other contacts it with its smooth surface. The patent also addresses a printed circuit board and a method for manufacturing the laminate.
Career Highlights
Kang’s listed patent work focuses on the structure of copper-clad laminates and their use in printed circuit boards. The disclosed arrangement distinguishes the foil layers by surface roughness and specifies how each layer contacts the insulating material.
Collaborations
Tae Ho Ko and Chang Jae Lee are identified as Kang’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on this invention.
Conclusion
Jun Ho Kang’s listed patent reflects work on copper-clad laminate design and printed circuit board manufacturing, associated with Samsung Electro-Mechanics Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile