Gumi, South Korea

Jun Hee Lee

This inventor holds 1 USPTO granted patent. Top assignee: Lg Siltron Incorporated. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Hee Lee. Retrieved from https://idiyas.com/inventor/jun-hee-lee-1xrv46nz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Jun Hee Lee - Innovator in Wafer Processing Technology

Introduction

Jun Hee Lee is a prominent inventor based in Gumi, South Korea. She has made significant contributions to the field of wafer processing technology. Her innovative approach has led to the development of a unique apparatus that enhances the efficiency of wafer polishing.

Latest Patents

Jun Hee Lee holds a patent for a wafer polishing apparatus and method. This invention is designed to improve the processing of wafers, which are essential in the semiconductor industry. The apparatus includes a first surface plate with multiple carriers, a central gear, and a motor that rotates the surface plate. The design allows for variable clearance between the first and second surface plates, optimizing the polishing process.

Career Highlights

Jun Hee Lee is associated with LG Siltron Incorporated, a company known for its advancements in semiconductor materials. Her work at LG Siltron has positioned her as a key player in the development of innovative wafer processing solutions. With her expertise, she continues to drive advancements in the industry.

Collaborations

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Conclusion

Jun Hee Lee's contributions to wafer processing technology exemplify her innovative spirit and dedication to advancing the semiconductor industry. Her patent reflects her commitment to improving manufacturing processes, making her a notable figure in her field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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