Hamburg, Germany

Julia Schönrock

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Julia Schönrock: Innovator in Pressure-Sensitive Adhesives

Introduction

Julia Schönrock is a prominent inventor based in Hamburg, Germany. She has made significant contributions to the field of adhesive technology, particularly in the development of pressure-sensitive adhesives. Her innovative work has led to the creation of a patented process that enhances the performance and application of adhesives in various electronic devices.

Latest Patents

Julia Schönrock holds a patent for a process for producing a pressure-sensitive adhesive based on acrylonitrile-butadiene rubber. This process involves a composition that includes at least one solid acrylonitrile-butadiene rubber and at least one tackifier resin. The method utilizes electron-beam irradiation with specific parameters to achieve a cured adhesive that is suitable for use in electronic devices. The patent also covers the production of adhesive tapes that incorporate this advanced adhesive, which can be used in mobile phones, tablets, and smartwatches.

Career Highlights

Julia Schönrock is associated with Tesa SE, a leading company in adhesive solutions. Her work at Tesa SE has been instrumental in advancing adhesive technologies, particularly in applications that require high-performance bonding solutions. With her expertise, she has contributed to the development of innovative products that meet the demands of modern electronic devices.

Collaborations

Julia has collaborated with notable colleagues, including CaiRong Lim and Yeliz Tepe. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in adhesive technology.

Conclusion

Julia Schönrock's contributions to the field of pressure-sensitive adhesives exemplify her commitment to innovation and excellence. Her patented processes and collaborative efforts continue to influence the adhesive industry, particularly in the realm of electronic devices.

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