Hamburg, Germany

Julia Befuss

This inventor holds 2 USPTO granted patents and 4 published patent applications and 2 EPO patents. Top assignee: Tesa Se. Active years: 2022-2026.

USPTO Granted Patents = 2 

% Patents Active = 50.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022-2026

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2 patents (USPTO):Explore Patents

Title: Julia Befuss: Innovating Adhesive Technologies in Hamburg

Introduction

Julia Befuss is a notable inventor based in Hamburg, Germany, recognized for her innovative advancements in adhesive systems. Her commitment to enhancing adhesive performance has led her to develop a unique product that emphasizes precision and stability in storage.

Latest Patents

Julia holds one patent for an innovative adhesive system comprised of multiple pressure-sensitive adhesive layers. The invention is intended to provide a stable adhesive system that allows for the precise positioning of adhesives while maintaining high-performance adhesive bonds. The kit includes at least two layers, A and B, both equipped with polymers that contain carboxy groups. Layer A uses activated carboxy groups for a strong bond, while Layer B facilitates accelerated crosslinking, creating a robust adhesive tape when combined.

Career Highlights

Julia befuss has made significant strides in her career as a dedicated inventor at Tesa SE, a leading company in adhesive products. Her research and patent reflect her deep understanding of polymer chemistry and the demands of practical applications in adhesive technologies.

Collaborations

In her endeavors, Julia collaborates with her coworker, Alexander Prenzel, combining their expertise to push the limits of adhesive technology. This teamwork has resulted in innovative solutions that meet the needs of various industries.

Conclusion

Julia Befuss stands as an example of how innovative thinking and collaboration can lead to groundbreaking inventions. Her patent not only highlights her ingenuity but also contributes to the advancement of adhesive technologies, promising a future of strong and reliable bonding solutions.

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