Oriniemi, Finland

Juha Rvenniemi

This inventor holds 1 USPTO granted patent. Top assignee: Stora Enso Oyj. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juha Rvenniemi. Retrieved from https://idiyas.com/inventor/juha-rvenniemi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Juha Rvenniemi: Innovator in Corrugated Board Technology

Introduction

Juha Rvenniemi is an inventor based in Oriniemi, Finland. He has made significant contributions to the field of corrugated board technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Juha Rvenniemi's latest patent applications include:

1. **MULTI-PLY LINER FOR USE IN CORRUGATED BOARD** - This invention relates to a multi-ply liner for use in corrugated board. The multi-ply liner comprises a first ply, which includes at least 70 wt % unbleached kraft pulp and between 5-30 wt % neutral sulfite semi-chemical (NSSC) pulp based on dry weight. The second ply consists of at least 50 wt % NSSC pulp and between 5-50 wt % unbleached kraft pulp based on dry weight.

2. **METHOD FOR MANUFACTURING FLUTING AND/OR LINER FOR CORRUGATED BOARD** - This method involves manufacturing fluting and/or liner for corrugated board. It includes steps such as using broke obtained from the manufacturing of liner in the pulp used for manufacturing of fluting, wherein at least 50% of the broke is external broke from the manufacturing of liner. Alternatively, it may involve using broke obtained from the manufacturing of fluting in the pulp used for manufacturing of liner, with at least 50% of the broke being external broke from the manufacturing of fluting.

Conclusion

Juha Rvenniemi is an innovative inventor whose work focuses on enhancing corrugated board technology through his latest patent applications. His contributions reflect a commitment to advancing the industry, and his ideas may lead to significant developments in the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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