Berglern, Germany

Juergen Von Czarnecki


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Juergen Von Czarnecki: Innovator in Adhesive Technology

Introduction

Juergen Von Czarnecki is a notable inventor based in Berglern, Germany. He has made significant contributions to the field of adhesive technology, particularly through his innovative patent that addresses the challenges of bonding contaminated substrates. His work has implications for improving manufacturing processes and reducing costs associated with cleaning and quality control.

Latest Patents

Juergen holds a patent titled "Process for bonding contaminated substrates." This invention introduces vibration energy, such as ultrasound, into an uncured adhesive matrix during and/or after the joining of substrates. This method effectively dissolves and disperses adhesion-reducing contaminants from substrate surfaces into the adhesive matrix. By utilizing this process, manufacturers can potentially reduce the costs associated with expensive cleaning processes and quality control measures.

Career Highlights

Juergen is associated with Henkel Kommanditgesellschaft Auf Aktien, a leading company in adhesive technologies. His work at Henkel has allowed him to focus on developing innovative solutions that enhance product performance and efficiency. With a patent portfolio that includes 1 patent, he continues to contribute to advancements in the industry.

Collaborations

Juergen has collaborated with notable colleagues, including Hubert K Schenkel and Matthias Von Hayek-Boelingen. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the field.

Conclusion

Juergen Von Czarnecki's contributions to adhesive technology exemplify the impact of innovation in manufacturing processes. His patented methods not only enhance product quality but also offer cost-effective solutions for industries facing challenges with contaminated substrates. His work continues to inspire advancements in adhesive applications.

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