Steinfurt, Germany

Juergen Peterseim

This inventor holds 1 USPTO granted patent. Top assignee: Fachhochschule Muenster. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juergen Peterseim. Retrieved from https://idiyas.com/inventor/juergen-peterseim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Juergen Peterseim: Innovator in Protective Layer Technology

Introduction

Juergen Peterseim is a notable inventor based in Steinfurt, Germany. He has made significant contributions to the field of protective materials, particularly through his innovative patent that addresses impact stress protection.

Latest Patents

Peterseim holds a patent for a workpiece comprising a laminate designed to protect against impact stress. The patent outlines a method for applying a protective layer, which involves mixing a sealing alloy in powder form with a binder and water to create a pasty compound. This compound is then applied to the surface that requires protection, dried, and subsequently heated to a temperature of at least 800°C.

Career Highlights

Juergen Peterseim is affiliated with the Fachhochschule Münster, where he contributes to research and development in materials science. His work focuses on enhancing the durability and resilience of materials used in various applications.

Collaborations

Peterseim collaborates with esteemed colleagues, including Denis Knust and Gerald Beermann, who share his commitment to advancing technology in protective materials.

Conclusion

Juergen Peterseim's innovative approach to impact stress protection through his patented technology exemplifies his dedication to improving material safety and performance. His contributions continue to influence the field of protective materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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