Wetter, Germany

Juergen Chaloupka

This inventor holds 1 USPTO granted patent. Top assignee: Daimler Chrysler Ag. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juergen Chaloupka. Retrieved from https://idiyas.com/inventor/juergen-chaloupka-wtcmskjd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Juergen Chaloupka: Revolutionizing Closure Devices

Introduction: Juergen Chaloupka, a brilliant inventor hailing from Wetter, Germany, has made significant contributions to the field of closure devices with his innovative patented creation.

Latest Patents: Juergen Chaloupka holds one groundbreaking patent for a Closure Device with a locally deflected spring wire for a closure flap. This invention features an actuating element that is distanced from the closure flap, allowing for seamless operation.

Career Highlights: Juergen Chaloupka is a valued member of the renowned company Daimler Chrysler AG, where his inventive mind has flourished. His dedication to enhancing closure mechanisms has garnered attention and praise within the industry.

Collaborations: Collaborating closely with talented individuals such as Juergen Koerber and Tilo Volkmann, Juergen Chaloupka has been able to exchange ideas and push boundaries in the realm of closure technology. Together, they form a dynamic team driving innovation forward.

Conclusion: Juergen Chaloupka's inventive spirit and commitment to excellence are evident in his remarkable patent for the Closure Device. His collaboration with esteemed colleagues further cements his position as a visionary in the field. With a bright future ahead, Juergen Chaloupka continues to inspire and shape the landscape of closure devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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