Company Filing History:
Years Active: 1991-1994
Title: Juergen Bednarz: Innovator in Electronic Component Encapsulation
Introduction
Juergen Bednarz is a notable inventor based in Penzberg, Germany. He has made significant contributions to the field of electronic component encapsulation, holding a total of 3 patents. His work focuses on enhancing the protection of electronic components against internal corrosion through innovative encapsulation methods.
Latest Patents
Juergen Bednarz's latest patents include a method and encapsulation for encapsulating electrical or electronic components. This invention involves accommodating a component or assembly in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. To enhance the sealing effect and protect against internal corrosion, an outside encapsulation of thermoplastic plastic is applied to the housing by injection molding. This application occurs at the joints of the housing and in the exit region of the terminal legs. The design includes encircling sections with a low wall thickness, which are fused to the outside encapsulation, particularly for hermetically tight encapsulation of surface-wave filters.
Career Highlights
Juergen Bednarz is associated with Siemens Aktiengesellschaft, a leading company in the technology sector. His work at Siemens has allowed him to develop and refine his innovative encapsulation techniques, contributing to the advancement of electronic component protection.
Collaborations
Throughout his career, Juergen has collaborated with notable colleagues, including Hans-Fr Schmidt and Siegfried Rauchmaul. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field.
Conclusion
Juergen Bednarz is a distinguished inventor whose work in electronic component encapsulation has made a significant impact on the industry. His innovative methods and collaborations continue to influence advancements in technology.