Siemens Aktiengesellschaft

Juergen Bednarz

Hans-Fr Schmidt

Siegfried Rauchmaul

Horst Scheffler

Hanns-Heinz Peltz

Karl-Heinz Horsmann

Ralf Criens

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.

Method and an encapsulation for encapsulating electrical or electronic

Method for encapsulating electronic components or assemblies using a

A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.

Three-dimensional printed circuit board

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Penzberg, Germany

Juergen Bednarz