Company Filing History:
Years Active: 2020-2023
Title: **Juan Sierra: Innovator in Interconnect Fabric Technology**
Introduction
Juan Sierra is an accomplished inventor based in San Jose, California, known for his significant contributions to the field of interconnect fabric technology. With a total of three patents to his name, he has been instrumental in developing procedures that enhance the efficiency of systems on chips (SoCs).
Latest Patents
Juan’s latest patents focus on optimizing transaction traffic on a System on Chip (SoC). His innovative procedures involve expanding transactions and consolidating responses at nodes within an interconnect fabric for various types of transactions, including broadcasts, multi-casts, any-casts, and source-based routing transactions. He has developed unique methodologies for intra-streaming multiple transactions over a defined stream using paired virtual channel-transaction classes. Additionally, his work includes trunking physical resources that share a common logical identifier, as well as employing hashing techniques to select among several physical resources with shared identifiers.
Career Highlights
Throughout his career, Juan Sierra has gained valuable experience working with prominent companies such as Provino Technologies, Inc. and Google Inc. His roles in these leading technology firms have allowed him to significantly impact the advancement of interconnect technologies.
Collaborations
Juan has collaborated with notable peers, including Shailendra Desai and Robert Totte. These collaborations have fostered innovative ideas and developments in the realm of SoCs, contributing to advancements that benefit the broader technology landscape.
Conclusion
In summary, Juan Sierra’s work in optimizing interconnect fabric for System on Chips demonstrates his commitment to innovation and efficiency. His contributions through patents and collaborative efforts highlight his role as a leading inventor in the technology sector. Juan continues to inspire future innovations in chip design and interconnect technologies.