Location History:
- Hsinchu, TW (2020)
- Tainan, TW (2024)
Company Filing History:
Years Active: 2020-2024
Title: Ju-Min Chen: Innovator in Semiconductor Technology
Introduction
Ju-Min Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and reliability of semiconductor packaging.
Latest Patents
One of Ju-Min Chen's latest patents is for a chip-on-wafer-on-substrate package with improved yield. This innovative semiconductor assembly includes a chip-on-wafer sub-assembly of integrated circuit dies mounted on an interposer. The interposer is then mounted on a package substrate, utilizing bonding bumps to create electrical connections. This design reduces the likelihood of failure mechanisms that can adversely affect yield by ensuring a proper balance in metal thickness between the top and bottom metallization stacks.
Another notable patent is for a semiconductor chip holder. This device is designed to protect semiconductor chips from potential damage during transport and storage. The chip holder is flexible and can be wound around a reel for convenience. It features a support substrate with receptacles for the chips, a cover layer to seal the receptacles, and plugs to securely couple the components together.
Career Highlights
Ju-Min Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance the performance and reliability of semiconductor devices.
Collaborations
Throughout his career, Ju-Min Chen has collaborated with notable colleagues, including Chia-Wei Chang and Jyun-Lin Wu. These partnerships have contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Ju-Min Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor packaging and reliability.