Ju Ho Shin

Title: Innovations of Ju Ho Shin in Multi-Layer Circuit Board Technology

Introduction

Ju Ho Shin is a notable inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of circuit board technology, particularly with his innovative designs and manufacturing methods. His work has led to advancements that enhance the efficiency and reliability of printed circuit boards (PCBs).

Latest Patents

Ju Ho Shin holds a patent for a multi-layer circuit board and its manufacturing method. The patent describes a PCB that incorporates multiple layers of heavy copper. A unique prepreg, which utilizes a nonwoven glass web substrate, is employed either alone or in conjunction with another prepreg that has a glass fabric substrate. This design allows for efficient filling of the space between heavy copper, comparable to a thick film, without creating voids. The PCB features a copper clad laminate with first copper patterned on one or both surfaces of a core substrate. Additionally, it includes at least one first prepreg laminated on one or both surfaces of the copper clad laminate, with the nonwoven glass web serving as the substrate for the first prepreg. Furthermore, at least one second prepreg is laminated on one or both surfaces of the first prepreg, utilizing glass fabric as the substrate for the second prepreg, along with second copper laminated on one or both surfaces of the second prepreg.

Career Highlights

Ju Ho Shin is currently employed at Doosan Corporation, where he continues to innovate and develop new technologies in the field of circuit boards. His expertise and dedication to his work have made him a valuable asset to the company.

Collaborations

Throughout his career, Ju Ho Shin has collaborated with talented individuals such as Jeong Don Kwon and Seung Min Hong. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Ju Ho Shin's contributions to the field of multi-layer circuit board technology exemplify his innovative spirit and commitment to advancing electronic manufacturing. His patent for a multi-layer circuit board showcases his ability to solve complex engineering challenges, making a lasting impact in the industry.