Ju Fan

Title: Ju Fan - Innovator in Bonding Technology

Introduction

Ju Fan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly with his innovative alignment tool designed for bonding apparatuses. His work has led to the development of a unique solution that addresses challenges faced in the alignment of devices during bonding processes.

Latest Patents

Ju Fan holds a patent for a "Bondhead alignment tool for a bonding apparatus." This invention features a loading surface that receives a pushing force from a device attached to the bonding apparatus. The design allows the loading surface to experience a tilting moment when subjected to an unequally distributed pushing force from a misaligned device. This tilting moment is transmitted to a sensing surface through a columnar body, which connects the two surfaces. An array of piezoelectric elements communicates with the sensing surface, producing electrical signals that enable a computing unit to detect the direction of tilt.

Career Highlights

Ju Fan is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in enhancing the efficiency and accuracy of bonding processes in various applications.

Collaborations

Ju Fan collaborates with talented individuals such as Ping Kong Joseph Choy and Chung Sheung Tate Yung. Their combined expertise contributes to the advancement of technology in their field.

Conclusion

Ju Fan's contributions to bonding technology through his innovative alignment tool demonstrate his commitment to improving industrial processes. His work not only showcases his inventive spirit but also highlights the importance of collaboration in driving technological advancements.