Vancouver, WA, United States of America

Joshua Jia Li


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: Joshua Jia Li

Introduction

Joshua Jia Li is an innovative inventor based in Vancouver, Washington. Renowned for his contributions to the semiconductor industry, Joshua has developed notable technologies that enhance the efficiency and effectiveness of semiconductor devices.

Latest Patents

He holds a patent titled "Mask layer and dual damascene interconnect structure in a semiconductor device." This invention describes a unique mask layer composed of four mask films utilized in the fabrication of an interconnect structure. The specifics of his invention include the equal etch rates of the first and third mask films, as well as the second and fourth, which facilitate the etching of vias and trenches necessary for semiconductor applications. The remaining passivation layer derived from the first mask film, alongside the conductive metal deposited, signifies a substantial advancement in semiconductor fabrication techniques.

Career Highlights

Joshua Jia Li is associated with Agere Systems Inc., a company recognized for its pioneering work in the semiconductor and telecommunications sectors. His contributions to the field are not only evidenced by his patent but also by his involvement in continuous research and development efforts aimed at improving semiconductor technology.

Collaborations

Throughout his career, Joshua has worked closely with colleagues such as Robert Y S Huang and Scott Jessen, leveraging their collective expertise to foster innovation and drive projects to successful completion within the company.

Conclusion

Joshua Jia Li's inventive spirit and dedication to semiconductor advancements illustrate the significant impact individual inventors can make in technology. His patented work not only contributes to current industry practices but also paves the way for future innovations in semiconductor design and fabrication.

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