Company Filing History:
Years Active: 2022
Title: Innovations by Josh Kaufman in Integrated Circuit Technology
Introduction
Josh Kaufman is a notable inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of integrated circuit technology, holding 2 patents that showcase his innovative approach to electronic components.
Latest Patents
Kaufman's latest patents include a method for forming a thin film resistor (TFR) in an integrated circuit device. The first patent describes a TFR formed using TFR cap layer(s) as an etch stop and/or hardmask. This method involves forming and annealing a TFR film over an IC structure, followed by the creation of a TFR cap layer. The TFR etch defines a TFR element, and a metal layer is formed to create contacts to the IC element contacts and the TFR element. The use of TFR cap layers, such as SiN and oxide caps, enhances the etching process by eliminating the need for a photomask.
The second patent focuses on forming a TFR using an oxide cap layer as a TFR etch hardmask. This process also eliminates the need for a photomask, streamlining the manufacturing process. TFR edge spacers are formed to insulate the edges of the TFR element, ensuring better performance and reliability in integrated circuits.
Career Highlights
Kaufman is currently employed at Microchip Technology Inc., where he continues to develop innovative solutions in the field of electronics. His work has contributed to advancements in integrated circuit design and manufacturing processes.
Collaborations
Throughout his career, Kaufman has collaborated with talented individuals such as Paul Fest and Jacob Lee Williams. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Josh Kaufman's contributions to integrated circuit technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods for forming thin film resistors are paving the way for advancements in electronic components.