Joseph Wu

Title: Joseph Wu - Innovator in Lead-Free Solder Technology

Introduction

Joseph Wu is a notable inventor based in Utica, NY (US). He has made significant contributions to the field of solder technology, particularly in developing lead-free solder solutions. His innovative approach addresses the growing demand for environmentally friendly materials in high-temperature applications.

Latest Patents

Joseph Wu holds a patent for a "Hybrid high temperature lead-free solder preform." This invention features a lead-free solder preform that includes a core layer and an adhesion layer coated over the surfaces of the core layer. The preform combines the merits of constituent solder alloys from both layers, providing high-temperature performance and improved wetting in applications such as die attach. The core layer is formed of a Bi Alloy with a solidus temperature above 260°C, while the adhesion layer can be made from various materials, including Sn, Bi alloys, and In alloys, with a solidus temperature below 245°C. The solder preform can be created using techniques such as electroplating, cladding, or dipping.

Career Highlights

Joseph Wu is currently employed at Indium Corporation, where he continues to innovate in the field of solder technology. His work focuses on developing advanced materials that meet the needs of modern electronics manufacturing. His patent reflects his commitment to enhancing the performance and sustainability of solder materials.

Collaborations

Joseph has collaborated with talented coworkers, including Hongwen Zhang and Jonathan Minter. Their combined expertise contributes to the innovative environment at Indium Corporation, fostering advancements in solder technology.

Conclusion

Joseph Wu's contributions to lead-free solder technology exemplify his dedication to innovation and sustainability in the electronics industry. His patent for the hybrid solder preform showcases his ability to address critical challenges in high-temperature applications.