Akron, OH, United States of America

Joseph W Reneker

This inventor holds 1 USPTO granted patent. Top assignee: The University of Akron. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph W Reneker. Retrieved from https://idiyas.com/inventor/joseph-w-reneker

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Joseph W. Reneker: Innovator in Electrospun Structures

Introduction

Joseph W. Reneker is a notable inventor based in Akron, Ohio. He has made significant contributions to the field of materials science, particularly in the development of electrospun structures. His innovative work has led to advancements in various applications, showcasing the potential of fiber and nanofiber technologies.

Latest Patents

Joseph W. Reneker holds a patent for "Electrospun structures and methods for forming and using same." This invention relates to structures that contain one or more fiber and/or nanofiber structures. These structures can be formed on a wide variety of surfaces, including asperities, flat surfaces, and hierarchical structures. The patent outlines processes for creating fibers and nanofibers designed to sequester, carry, and encapsulate various substances.

Career Highlights

Reneker's career is marked by his role at the University of Akron, where he has contributed to research and development in materials science. His work has not only advanced academic knowledge but has also paved the way for practical applications in various industries.

Collaborations

Throughout his career, Joseph W. Reneker has collaborated with esteemed colleagues, including Darrell H. Reneker and Tao Han. These partnerships have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Joseph W. Reneker's contributions to the field of electrospun structures highlight his role as a leading inventor. His innovative patent and collaborative efforts continue to influence advancements in materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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