Taoyuan, Taiwan

Joseph Hsia

This inventor holds 1 USPTO granted patent. Top assignee: Fci, Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph Hsia. Retrieved from https://idiyas.com/inventor/joseph-hsia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Joseph Hsia: Innovator in Connector Technology

Introduction

Joseph Hsia is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of connector technology. His innovative designs have led to the development of a unique connector that addresses specific challenges in electrical engineering.

Latest Patents

Joseph Hsia holds 1 patent for his invention related to a connector. The connector features a housing with multiple terminals for electrical contact with a board. It includes a pair of arms extending from the housing, each equipped with projections and a metal member that aids in maintaining the integrity of the connection. This design allows for adjustments to remedy overwarp of the board or housing when soldered to a board.

Career Highlights

Joseph Hsia is currently employed at FCI, Inc., where he continues to innovate in connector technology. His work has been instrumental in enhancing the reliability and functionality of electrical connectors in various applications.

Collaborations

Joseph has collaborated with talented coworkers such as Gary Hsieh and Nick Chin. Their combined expertise has contributed to the advancement of connector designs and technologies.

Conclusion

Joseph Hsia's contributions to connector technology exemplify his innovative spirit and dedication to improving electrical engineering solutions. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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