This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Joseph Dibene: Innovator in Wafer Level Packaging
Introduction
Joseph Dibene is a notable inventor based in San Diego, California. He has made significant contributions to the field of technology, particularly in the area of wafer level packaging for thin film inductors. His work is recognized for its innovative approach and practical applications in the industry.
Latest Patents
Joseph holds a patent for a "Wafer Level Packaging Process for Thin Film Inductors." This patent showcases his expertise and commitment to advancing technology in the semiconductor field. He has 1 patent to his name, reflecting his innovative contributions.
Career Highlights
Joseph is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His role at Qualcomm allows him to work on cutting-edge technologies and contribute to the development of advanced electronic devices.
Collaborations
Joseph collaborates with talented individuals in his field, including his coworker Anshih Tseng. Their combined efforts contribute to the innovative projects at Qualcomm, enhancing the company's reputation for technological advancement.
Conclusion
Joseph Dibene is a dedicated inventor whose work in wafer level packaging has made a significant impact in the technology sector. His contributions continue to shape the future of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile