Frisco, TX, United States of America

Joseph Anthony Boduch

This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2018-2021.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018-2021

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3 patents (USPTO):Explore Patents

Title: Joseph Anthony Boduch: Innovator in Semiconductor Testing Technologies

Introduction

Joseph Anthony Boduch is a notable inventor based in Frisco, TX (US). He has made significant contributions to the field of semiconductor testing, holding a total of 3 patents. His work focuses on enhancing the methodologies and technologies used in wafer probing and die testing.

Latest Patents

One of his latest patents is titled "Wafer probe resumption of die testing." This innovation provides methodologies for resuming the probing of a wafer after an interruption. It retains parameter settings and probe results from previous sessions to construct a resume probe map, allowing for efficient continuation of testing. Another significant patent is "Data structures for semiconductor die packaging." This system includes a data structure that cross-references various identifiers related to semiconductor wafers and lead frames, facilitating improved testing processes for packaged dies.

Career Highlights

Joseph Anthony Boduch is currently employed at Texas Instruments Corporation, where he continues to develop innovative solutions in semiconductor technology. His expertise in wafer testing methodologies has positioned him as a key contributor to advancements in the industry.

Collaborations

Throughout his career, Boduch has collaborated with talented individuals such as Sandia You Ni Chiu and Robert Daniel Orr. These partnerships have fostered a collaborative environment that enhances innovation and problem-solving in semiconductor testing.

Conclusion

Joseph Anthony Boduch's contributions to semiconductor testing technologies exemplify his commitment to innovation. His patents reflect a deep understanding of the complexities involved in wafer probing and die testing, making him a valuable asset in the field.

Profile summary based on public USPTO records.
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