Jordan K Hu

Title: Jordan K Hu - Innovator in Liquid Cooling Technology

Introduction

Jordan K Hu is an accomplished inventor based in Santa Clara, CA. He has made significant contributions to the field of electronic cooling systems, particularly through his innovative patent related to liquid cooling using printed circuit board (PCB) through holes. His work is essential for enhancing the efficiency of electronic components.

Latest Patents

Jordan K Hu holds a patent for a liquid cooling system designed for electronic components mounted on a PCB. This system utilizes PCB through holes to transport a liquid coolant effectively. The cooling system features a coolant loop that circulates the coolant via a pump. It includes a cooling sub-assembly with a cooling channel that is thermally coupled to the component needing cooling. The design incorporates a coolant supply PCB through hole that delivers cooled coolant from a supply manifold on the PCB's bottom side to the cooling channel on the top side. Additionally, a coolant return PCB through hole carries heated coolant back to the return manifold. The system is equipped with a control system that manages coolant distribution based on component temperatures.

Career Highlights

Jordan K Hu is currently employed at Cisco Technology, Inc., where he continues to develop innovative solutions in electronic cooling. His expertise in this area has positioned him as a valuable asset to his team and the company.

Collaborations

Jordan collaborates with talented coworkers, including Tushara Ramesh and Bhumil Depani, who contribute to the advancement of technology in their projects.

Conclusion

Jordan K Hu's contributions to liquid cooling technology demonstrate his commitment to innovation in the electronics field. His patent reflects a significant advancement in cooling systems, which is crucial for the performance and longevity of electronic components.