San Jose, CA, United States of America

Joonhee Hwang

This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joonhee Hwang. Retrieved from https://idiyas.com/inventor/joonhee-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Joonhee Hwang and Network Resource Management

Introduction

Joonhee Hwang is an inventor based in San Jose, California, and is associated with Qualcomm Incorporated. His patent work addresses ways to manage network resources and device power consumption as a user equipment’s form factor changes.

Latest Patents

Hwang is named on 1 patent: “Predicting Bandwidth and Power Savings for Different Form Factors.” The invention describes methods for managing a device’s dual-channel capability. A user equipment can determine its maximum throughput from connection parameters, receive an indication that its form factor has changed, and measure actual throughput over a specified time window. It can then compare actual throughput with maximum throughput, using thresholds, to decide whether to enable or disable dual connectivity.

Career Highlights

Hwang’s listed patent reflects work on adapting wireless connectivity to device conditions. By considering form factor and throughput together, the disclosed approach aims to balance network performance with power efficiency.

Collaborations

The provided information lists HeeGyum Kim and Julee Park as Hwang’s coworkers. They are also associated with Qualcomm Incorporated.

Conclusion

Joonhee Hwang’s patent focuses on using throughput measurements and device form-factor changes to guide dual-connectivity decisions, with the goal of managing bandwidth and power efficiently.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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