Yongin, South Korea

Joong-do Kom

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Aerospace Industries, Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joong-do Kom. Retrieved from https://idiyas.com/inventor/joong-do-kom

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Joong-do Kom: Innovator in Multi-layer Plated Lead Frame Technology

Introduction

Joong-do Kom is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of lead frame technology, particularly through his innovative patent. His work is recognized for enhancing the performance and reliability of electronic components.

Latest Patents

Joong-do Kom holds a patent for a multi-layer plated lead frame. This invention features a unique structure where a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame demonstrates improvements in various properties, including wire bonding, anti-corrosion, and solderability. He has 1 patent to his name.

Career Highlights

Joong-do Kom is currently employed at Samsung Aerospace Industries, Ltd., where he continues to innovate and develop advanced technologies. His work at this prestigious company has allowed him to contribute to significant advancements in the aerospace sector.

Collaborations

Throughout his career, Joong-do has collaborated with talented individuals such as Young-ho Baek and Kyung-soon Bok. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Joong-do Kom's contributions to the field of lead frame technology exemplify his dedication to innovation. His patent for the multi-layer plated lead frame showcases his ability to enhance electronic component performance. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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