This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Joo-young Oh: Semiconductor Packaging Inventor
Introduction
Joo-young Oh is an inventor based in Suwon, South Korea. His patent work includes semiconductor packaging, and he is associated with Samsung Electronics Ltd. The supplied information lists 1 patent.
Latest Patents
Oh’s listed patent, “Semiconductor package,” describes a package with two offset chip stacks mounted on a substrate. The first stack includes a semiconductor chip, an adhesive layer, and a chip protection structure. The second stack includes corresponding components, with an extension of its adhesive layer positioned beside the first stack’s protection structure. An underfill pattern extends along the first stack to that adhesive extension. This arrangement describes how the stacked components and underfill are positioned within the package.
Career Highlights
The available information connects Oh’s patent activity to semiconductor packaging and identifies Samsung Electronics Ltd. as his company. No additional career details were provided.
Collaborations
Hwan Pil Park is identified as Oh’s coworker. The supplied information does not specify a particular joint patent or project between them.
Conclusion
Joo-young Oh’s listed invention concerns the structure and arrangement of components in a semiconductor package, reflecting his documented work in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile