Yongin, South Korea

Jongtae Lim

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Solus Advanced Materials Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jongtae Lim. Retrieved from https://idiyas.com/inventor/jongtae-lim-tbl9lbvf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jongtae Lim and High-Temperature-Stable Epoxy Encapsulation

Introduction

Jongtae Lim is an inventor associated with Yongin, South Korea, and Solus Advanced Materials Co., Ltd. His listed patent concerns an epoxy resin composition designed for high-temperature stability and use in encapsulation materials.

Latest Patents

Lim is credited with 1 patent: “High Temperature Stability Epoxy Resin Composition and Encapsulation Material Comprising the Same.” The invention proposes a low-viscosity epoxy composition that can be injected into gaps by inkjetting or dispensing and then cured. It is designed to provide strong adhesion and stability at high temperatures during curing. Potential applications include binding or molding glass components in organic and inorganic light-emitting display screens.

Career Highlights

The patent reflects Lim’s work on materials for precision gap filling and display encapsulation. Its proposed liquid-application methods may support manufacturing processes that require controlled dispensing followed by curing.

Collaborations

Lim’s listed company is Solus Advanced Materials Co., Ltd. His coworker, Hongsuk Kim, is also associated with the patent information provided.

Conclusion

Jongtae Lim’s patent presents an epoxy encapsulation material intended to combine processability, adhesion, and high-temperature stability for display-related applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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