Gyeonggi-do, South Korea

Jonghoon Won

USPTO Granted Patents = 30 

 

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 41(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2018 - 2022)
  • Suwon-si, KR (2019 - 2023)
  • Yongin-si, KR (2022 - 2024)

Company Filing History:


Years Active: 2018-2025

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):

Title: The Innovative Mind of Jonghoon Won

Introduction:

Jonghoon Won, a prolific inventor hailing from Gyeonggi-do, South Korea, has made significant contributions to the field of materials science and semiconductor technology. With an impressive portfolio of 24 patents under his belt, Won's groundbreaking work has shaped the landscape of high-thermal conductive compounds and semiconductor packaging materials.

Latest Patents:

Among his latest patents is the "High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package." This patent showcases an epoxy compound with a unique molecular structure designed for enhanced thermal conductivity in electronic devices.

Career Highlights:

Jonghoon Won is a key figure at Samsung Electronics Co., Ltd., where his innovative spirit has flourished. His tenure at Samsung has been marked by a series of groundbreaking inventions that have propelled the company to the forefront of technological innovation.

Collaborations:

Within Samsung Electronics Co., Ltd., Won collaborates closely with esteemed coworkers like Youngkwon Yoon and Dongsoo Kim. Together, they form a dynamic team that is dedicated to pushing the boundaries of possibility in the realm of materials science and semiconductor technology.

Conclusion:

In conclusion, Jonghoon Won stands as a shining example of ingenuity and dedication in the field of innovation. His inventive prowess and collaborative spirit have not only earned him numerous patents but have also cemented his legacy as a trailblazer in the world of high-tech materials and semiconductor packaging.

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