The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jun. 11, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Kyeong Pang, Suwon-si, KR;
In Kim, Suwon-si, KR;
Jonghoon Won, Yongin-si, KR;
Mooho Lee, Suwon-si, KR;
Hyejeong Lee, Suwon-si, KR;
Songwon Hyun, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); C09D 5/00 (2006.01); C09D 163/00 (2006.01); C09K 5/14 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); C09D 5/00 (2013.01); C09D 163/00 (2013.01); C09K 5/14 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01);
Abstract
A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1-L1-M2-L2-M3-L3-A-L3-M3-L2-M2-L1-M1-E2 Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.