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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11926695 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Jun. 11, 2020

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kyeong Pang, Suwon-si, KR;

In Kim, Suwon-si, KR;

Jonghoon Won, Yongin-si, KR;

Mooho Lee, Suwon-si, KR;

Hyejeong Lee, Suwon-si, KR;

Songwon Hyun, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); C09D 5/00 (2006.01); C09D 163/00 (2006.01); C09K 5/14 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); C09D 5/00 (2013.01); C09D 163/00 (2013.01); C09K 5/14 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01);
Abstract

A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1-L1-M2-L2-M3-L3-A-L3-M3-L2-M2-L1-M1-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

Find Patent Forward Citations

Quick Actions:

Pang, Kyeong. (2024). High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same (U.S. Patent No. 11926695). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11926695

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