Location History:
- Seoul, KR (2023)
- Hwaseong-si, KR (2023)
Company Filing History:
Years Active: 2023-2025
Title: **Innovator Spotlight: Jonggu Lee**
Introduction
Jonggu Lee is a prominent inventor based in Seoul, South Korea, with a significant contribution to the field of semiconductor manufacturing. With a total of three patents to his name, Lee has made noteworthy advancements that enhance the efficiency and effectiveness of die bonding processes.
Latest Patents
Lee's most recent innovations include a groundbreaking method of manufacturing a semiconductor package. His patents specifically detail a bonding head for a die bonding apparatus and the apparatus itself. The bonding head features a head body with a thermal pressurizer mounted on its lower surface. This thermal pressurizer is designed to hold and heat at least one die, utilizing a heater with a first heating surface that directly faces the die. Furthermore, Lee has described a thermal compensator located at the outer region of the die, which extends downwardly from the body and includes multiple thermal compensating blocks. These blocks have a second heating surface that emits heat and interfaces with the side surface of the die, significantly improving the bonding process.
Career Highlights
Jonggu Lee works at Samsung Electronics Co., Ltd., one of the leading technology companies in the world. His role in the semiconductor division has allowed him to apply innovative approaches to complex manufacturing processes. His expertise in die bonding technologies places him at the forefront of advancements in the semiconductor industry.
Collaborations
Throughout his career, Lee has collaborated with notable colleagues such as Sebin Choi and Sunghyup Kim. These partnerships have fostered a creative and productive environment, leading to the successful development of patents that have a substantial impact on the manufacturing processes within Samsung Electronics.
Conclusion
Jonggu Lee exemplifies the spirit of innovation within the semiconductor industry. His patents not only reflect his technical expertise but also his commitment to advancing manufacturing technologies. As he continues to push the boundaries of what's possible, Lee is undoubtedly making significant contributions that will shape the future of semiconductor packaging.