Tucheng, Taiwan

Jong Tseng

This inventor holds 1 USPTO granted patent. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong Tseng. Retrieved from https://idiyas.com/inventor/jong-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Jong Tseng and His Card Edge Connector Patent

Introduction

Jong Tseng is an inventor associated with Tucheng, Taiwan, and Hon Hai Precision Industry Co., Ltd. His recorded patent concerns a card edge connector designed to secure and electrically connect a daughter board.

Latest Patents

Tseng’s listed patent is titled “Card Edge Connector.” It describes an elongated housing with a slot for receiving a daughter board, contacts that connect with the board’s gold fingers, and ejectors mounted at both ends of the housing. The ejectors include clasps and head portions that engage the board’s edges and notches. A thin rib on each head portion presses against the lower inner surface of a notch to help prevent vertical movement. Tseng is associated with 1 patent.

Career Highlights

The available information associates Tseng with Hon Hai Precision Industry Co., Ltd. His patent reflects work on connector design, particularly the positioning and retention of daughter boards.

Collaborations

Yuh-Huey Kang is identified as Tseng’s coworker. The provided information does not specify their roles in the patent or describe any particular collaboration.

Conclusion

Jong Tseng’s recorded invention focuses on a card edge connector that combines electrical contact with features intended to hold a daughter board securely in place.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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