This inventor holds 1 USPTO granted patent. Top assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 138,671 
1 out of 802 
Years Active: 2017
Title: Jong Jin Weon: Inventor of a Die-Bonding Apparatus
Introduction
Jong Jin Weon is an inventor associated with Cheonan, South Korea. His work includes a patent for a bonding head and die-bonding apparatus designed to hold and transfer a die while managing heat.
Latest Patents
Weon is credited with 1 patent: “Bonding Head and Die Bonding Apparatus Having the Same.” The invention describes a bonding head with a body connected to a driving section, a plate heater mounted beneath the body, and a collet that holds a die using vacuum pressure. A cooling channel on the body’s lower surface connects to passages that circulate cooling fluid, helping cool the plate heater.
Career Highlights
Weon’s listed company affiliations include SEMES Co., Ltd. and Samsung Electronics Co., Ltd. His patent reflects work on thermal management and die handling in semiconductor assembly equipment.
Collaborations
His listed coworkers include Seung Dae Seok and Hang Lim Lee.
Conclusion
Jong Jin Weon’s patent combines vacuum-based die holding with fluid cooling, contributing to the design of semiconductor die-bonding equipment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile