This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Skhynix Inc.. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Jong Hyock Park: Innovator in Semiconductor Packaging
Introduction
Jong Hyock Park is a notable inventor based in Icheon, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative methods and techniques.
Latest Patents
One of Jong Hyock Park's key patents is titled "Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase." This patent discloses a method for fabricating a semiconductor package using a mold press equipped with upper and lower chases. The process involves dispensing a molded underfill (MUF) material on the bottom surface of a mold cavity to create a serpentine-shaped first dispensed pattern. A base substrate, which supports die stacks, is then loaded onto the upper chase. The mold cavity is closed, allowing the MUF material to flow between the die stacks, effectively impregnating them.
Career Highlights
Jong Hyock Park is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work focuses on advancing semiconductor packaging technologies, which are crucial for enhancing the performance and reliability of electronic devices.
Collaborations
Throughout his career, Jong Hyock Park has collaborated with talented colleagues, including Kyung Beom Seo and Jong Kyu Moon. These collaborations have contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Jong Hyock Park's contributions to semiconductor packaging through his patent and work at SK Hynix Inc. highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of semiconductor technology.